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What should we pay attention to during the production of Blister Tray For Hardware And Electronic Parts?

Publish Time: 2024-06-06
The following matters need to be noted during the production of Blister Tray For Hardware And Electronic Parts:

1. Material selection and specifications

Material selection: Blister trays usually use plastic sheets such as PET, PS, ABS as raw materials. These materials should have good temperature resistance, anti-aging performance and mechanical strength.

Specification requirements: For Blister Tray For Hardware And Electronic Parts, the material thickness is generally required to be above 0.6mm to ensure the load-bearing capacity and stability of the tray.

2. Design and mold making

Size determination: According to the size and shape of hardware and electronic parts, the size and shape of the blister tray are reasonably determined to ensure that the parts can be placed firmly on the tray.

Mold making: The mold should be made accurately and durable. Commonly used mold materials include aluminum alloy, gypsum, epoxy resin, etc. The precision and quality of the mold directly affect the quality of the blister tray.

3. Blister and molding

Heating temperature: During the blister process, the heating temperature should be moderate to ensure that the plastic sheet can be evenly softened and fit on the mold.

Molding pressure: Appropriate molding pressure helps the plastic sheet fit completely on the mold to form the desired shape. But excessive pressure may cause the tray to deform or damage.

4. Cooling and trimming

Cooling process: After the tray is taken out of the mold, it should be placed on a cooling rack for even cooling to avoid deformation or cracking of the tray.

Trimming work: Trim the cooled tray to remove excess material, trim burrs, etc. to ensure that the edges and surfaces of the tray are smooth.

5. Inspection and packaging

Quality inspection: Perform quality inspection on the finished tray to ensure that the tray meets quality requirements, such as dimensional accuracy, surface quality, etc.

Packaging processing: According to the characteristics and requirements of the tray, select appropriate packaging materials for packaging to ensure that the tray is not damaged during transportation and storage.

The above are the matters that need to be paid attention to in the production process of Blister Tray For Hardware And Electronic Parts. By strictly controlling the process parameters and quality requirements of each link, it can be ensured that the quality and performance of the blister tray meet customer needs.
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